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to pidsa hq AN44066A-VF 1203029 receipt date: / / issuance date: / / panasonic global part number vendor issue number orderer (customer) part number "changes in the description of delivery specifications" and "chang es that affect performance, quality or environment" are imple mented according to advance consultation. orderer (customer) vendor confirmation of security control we confirm and certify that the products of these specifications sha ll not be supplied so as to be used for military purpose (de fined herein below). "military purpose" in this statem ent means the design, development, manufactu re, storage or use of any weapons, includi ng without limitation nuclear weapons, biologi cal weapons, chemical weapons and missiles. delivery specifications industrial devices company, panasonic corporation smart puniness distraction s423140-09#01 3.12 2012.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described i n this book is to be exported or provided to non-residents, the laws and regulations of the expo rting country, especially, those with regard to security export control, must be observed. (2)the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical inf ormation de-scribed in this book. (3)the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instrumen ts and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the follo wing applications: ?special applications (such as for airplanes, aerospace, automo tive equipment, traffic signaling equipment, combustion equipment, life support systems and safet y devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held respo nsible for any damage incurred as a result of or in connection with your using the products describ ed in this book for any special application, unless our company agrees to your using the produc ts in this book for any special application. (4)when designing your equipment, comply with the range of abso lute maximum rating and the guaranteed operating conditions (operating power supply voltage and operat ing environment etc.). especially, please be careful not to exceed the range of absolute maximum r ating on the transient state, such as power-on, power-off and mode-switching. other-wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, t ake into the consideration of incidence of break down and failure mode, possible to occur to semiconduc tor products. measures on the systems such as redundant design, arresting the spread of fire or preve nting glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (5)comply with the instructions for use in order to prevent bre akdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical st ress) at the time of handling, mounting or at customer's process. when using products for which damp-pr oof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (6)this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. reprint from warning label standards sc3-11-00007 this delivery specifications may include old company names such as ?matsushita electronics corporation? o r ?semiconductor company, matsushita electric industrial co., ltd .??semiconductor company, panasonic corporation ? please interpret these old company names as industrial devices company, panasonic corporation? as of january 1, 2012.
established revised product standards regulations no.: total pages page 1 37 an44066a part no. package code no. ssop032-p-0300b part no. package code no. semiconductor company, matsushita electric industrial co., ltd. established by applied by checked by prepared by semiconductor company matsushita electric industrial co., ltd. m.hiramatsu y.kakizaki t.iwami 214406600108040 2008-04-11 ic3f5211
2 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600208040 2008-04-11 contents ? overview ????????????????????.????????????????????? 3 ? features ???????????????????.?????????????????????? 3 ? applications ???????????????????.????????????????????? 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example ????????????????????????????????? 4 ? block diagram ??????????????????.????????????????????? 5 ? pin descriptions ????????????????.?????????????????????? 6 ? absolute maximum ratings ????????????.????????????????????? 7 ? operating supply voltage range ????????.????????? ?????????????? 7 ? allowable current and voltage range ????????????? ???????????????? 8 ? electrical characteristics ?????.????????????????????????????? 9 ? electrical characteristics (reference values for design) ?????.????????????????. 11 ? test circuit diagram ???????????.????????????????????????? 12 ? electrical characteristics test procedures ????.???????????????????????. 16 ? technical data ????????????????.??????????????????????? 21 y i/o block circuit diagrams and pin f unction descriptions ? ????????????? ???????. 21 y control mode ?????????????.?????????????????????????. 26 ? usage notes ????????????????. ????????????? ??????????. 31 y special attention and precaution in using ????????? ???????????? ??????. 31 y notes of power lsi ????????????????????????????????????. 32
3 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600308040 2008-04-11 an44066a driver ic for stepping motor ? overview an44066a is a two channels h-bridge driv er ic. bipolar stepping motor can be controlled by this single driver ic. 2-phase, half-step, 1-2 phase, w1-2 phase can be selected. ? features y 2-phase input control by rationalization of interface (2-pha se excitation, half-step, a nd 1-2 phase excitation enabled) y 4-phase input control (w1- 2 phase excitation enabled) y built-in cr chopping (with frequency selected) y built-in standby function y built-in thermal protection and low voltage detection circuit y built-in 5 v power supply ? applications y ic for stepping motor drives ? package y 32 pin plastic shrink small outline package (ssop type) ? type y bi-cdmos ic
4 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600408040 2008-04-11 ? application circuit example note) y this application circuit is shown as an example but does not guarantee the design for mass production set. charge pump vpump bc1 bc2 gate circuit phb1 in3 in2 vrefb r s rcsb bout2 bout1 gate circuit pha1 enablea in0 in1 vrefa rcsa aout1 aout2 blank osc tsd uvlo reg vm1 vm2 vm s5vout gnd tjmon pwmsw pwmsw 0.01 f 0.01 f 0.1 f 47 f 0.1 f stby in0 in2 s5vout r q q s 18 17 26 30 29 20 32 24 19 28 27 31 25 22 21 16 3 5 7 15 1 9 11 13 23
5 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600508040 2008-04-11 note) this block diagram is for explaining functions. the part of the block diagram may be omitted, or it may be simplified. ? block diagram charge pump gate circuit gate circuit blank osc tsd uvlo reg vm pwmsw in0 in2 s5vout r s q r q s bc1 bc2 phb1 in3 in2 vrefb pha1 enablea in0 in1 vrefa s5vout tjmon pwmsw stby 18 17 26 30 29 20 32 24 19 28 27 31 25 22 21 vpump rcsb bout2 bout1 rcsa aout1 aout2 vm1 vm2 gnd 16 3 5 7 15 1 9 11 13 23
6 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600608040 2008-04-11 phase b output torque control 2 input in3 30 phase a/b start/stop signal input input enablea 31 vbe monitor output tjmon 32 phase b output torque control 1 input in2 29 pwm frequency selection input input pwmsw 24 signal ground ground gnd 23 standby setting input stby 22 internal reference voltage (5 v output) output s5vout 21 phase b torque reference voltage input input vrefb 20 phase a torque refe rence voltage input input vrefa 19 charge pump capacitor connection 1 output bc1 18 charge pump capacitor connection 2 output bc2 17 phase a output torque control 2 input in1 28 phase a output torque control 1 input in0 27 phase b phase selection input input phb1 26 phase a phase selection input input pha1 25 charge pump circuit output output vpump 16 motor power supply 2 power supply vm2 15 n.c. ? n.c. 14 phase a motor drive output 1 output aout1 13 n.c. ? n.c. 12 phase a current detection input / output rcsa 11 n.c. ? n.c. 10 phase a motor drive output 2 output aout2 9 n.c. ? n.c. 8 phase b motor drive output 1 output bout1 7 n.c. ? n.c. 6 phase b current detection input / output rcsb 5 n.c. ? n.c. 4 phase b motor drive output 2 output bout2 3 n.c. ? n.c. 2 motor power supply 1 power supply vm1 1 description type pin name pin no. ? pin descriptions
7 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600708040 2008-04-11 *4 a 0.8 i f flywheel diode current (pin 3, 7, 9, 13) 7 *3 c ?55 to +150 t stg storage temperature 4 *4 v 37 v out output pin voltage (pin 3, 7, 9, 13) 5 *4 a 0.8 i out motor drive current (pin 3, 7, 9, 13) 6 note unit rating symbol parameter a no. *3 c ?20 to +70 t opr operating ambient temperature 3 *2 w 0.427 p d power dissipation 2 *1 v 37 v m supply voltage (pin 1, 15) 1 ? absolute maximum ratings note) absolute maximum ratings are limit values which are not dest ructed, and are not the values to which operation is guarantee d. notes) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 70 c for the independent (unmounted) ic package without a heat sink. when using this ic , refer to the p d -t a diagram of the package standard and design the heat radiation with sufficie nt margin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. *4 : do not apply external currents or volta ges to any pin not specifically mentioned. for the circuit currents, "+" denotes current flowing into the ic, and " " denotes current flowing out of the ic. * v 10.0 to 34.0 v m operating supply voltage range note unit range symbol parameter note) *: the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. ? operating supply voltage range
8 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600808040 2008-04-11 ? v ?0.3 to 6 stby 22 ? v ?0.3 to 6 pwmsw 24 ? v ?0.3 to 6 pha1 25 ? v ?0.3 to 6 phb1 26 ? v ?0.3 to 6 in0 27 ? v ?0.3 to 6 in1 28 ? v ?0.3 to 6 in2 29 ? v ?0.3 to 6 in3 30 ? v ?0.3 to 6 enablea 31 ? v 2.5 rcsb 5 ? v 2.5 rcsa 11 *1 v (v m ?1)to43 vpump 16 *1 v (v m ?1) to43 bc2 17 *1 v v m + 0.3 bc1 18 ? v ?0.3 to 6 vrefa 19 ? v ?0.3 to 6 vrefb 20 note unit rating pin name pin no. *1 *2 ma ?5 to 0 s5vout 21 note unit rating pin name pin no. ? allowed voltage and current ranges notes) y rating voltage is voltage of pin on gnd y do not apply current or voltage from outside to any pin not listed above. y for the circuit currents, "+" denotes current flowing into the ic, and " " denotes current flowing out of the ic. notes) *1 : do not apply external voltages to this pin. set not to exceed allowable range at any time. *2 : this is the rating under the condition that v m is used in the range between 16 v and 34 v. when v m is used in the range between 10 v and 16 v, the rating is ?1.4 ma to 0.
9 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406600908040 2008-04-11 ? ma 8.2 5.4 ? enablea = 3.3 v stby = 0 v 1 i m supply current (at when only control system and charge pump circuit are on) 5 ? a 15 ? ?15 pwmsw = 0 v 1 i pwmswl low-level pwmsw input current 22 ? v 5.5 ? 2.1 ? 1 v stbyh high-level stby input voltage 23 ? v 0.6 ? 0 ? 1 v stbyl low-level stby input voltage 24 ? a 45 30 ? stby = 5 v 1 i stbyh high-level stby input current 25 ? a 2 ? ?2 stby = 0 v 1 i stbyl low-level stby input current 26 ? v 5.5 ? 2.2 ? 2 v pwmswh high-level pwmsw input voltage 19 ? a 33 16.5 8 pwmsw = 3.3 v 1 i pwmswh high-level pwmsw input current 21 ? v 0.6 ? 0 ? 2 v pwmswl low-level pwmsw input voltage 20 ? a 15 ? ?15 enablea = 0 v 1 i enableal low-level enablea input current 18 i/o block ? a 20 10 ? v m = 37 v, v rcs = 0 v 1 i leak output leakage current 4 ? a 10 ? ?10 enablea = 5 v 1 i enableah high-level enablea input current 17 ? v 0.6 ? 0 ? 1 v enableal low-level enablea input voltage 16 ? v 5.5 ? 2.2 ? 1 v enableah high-level enablea input voltage 15 ? a 15 ? ?15 pha1 = phb1 = 0 v 1 i phal i phbl low-level pha1/phb1 input current 14 ? a 66 33 16.5 pha1 = phb1 = 3.3 v 1 i phah i phbh high-level pha1/phb1 input current 13 ? v 0.6 ? 0 ? 1 v phal v phbl low-level pha1/phb1 input voltage 12 ? v 5.5 ? 2.2 ? 1 v phah v phbh high-level pha1/phb1 input voltage 11 ? a 15 ? ?15 in0 = in1 = in2 = in3 = 0 v 1 i inl low-level in input current 10 in0 = in1 = in2 = in3 = 5 v ? i in = 0.5 a ? v 1.5 1.0 0.5 i in = 0.5 a 4 v di flywheel diode forward voltage 3 ? a 190 120 ? stby = 2.1 v 1 i stby supply current (at standby mode) 6 ? v 5.5 ? 2.2 1 v inh high-level in input voltage 7 ? v 0.6 ? 0 ? 1 v inl low-level in input voltage 8 power block ? v ? v m ? 0.31 v m ? 0.47 i in = ?0.5 a 3 v oh high-level output saturation voltage 1 ? v 0.71 0.47 ? 3 v ol low-level output saturation voltage 2 ? a 10 ? ?10 1 i inh high-level in input current 9 limits typ unit max test circuits note min conditions symbol parameter b no. ? electrical characteristics at v m = 24 v note) t a = 25 c 2 c unless otherwise specified.
10 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601008040 2008-04-11 torque control block reference voltage block ? mv 693 660 627 v refa = v refb = 3.3 v in0 = in1 = 0.6 v in2 = in3 = 0.6 v 1 vt h comp threshold h (100%) 31 ? mv 470 440 410 v refa = v refb = 3.3 v in0 = 2.2 v, in1 = 0.6 v in2 = 2.2 v, in3 = 0.6 v 1 vt c comp threshold c (67%) 32 ? mv 240 220 200 v refa = v refb = 3.3 v in0 = 0.6 v, in1 = 2.2 v in2 = 0.6 v, in3 = 2.2 v 1 vt l comp threshold l (33%) 33 ? khz 35 26 17 pwmsw = 2.2 v 2 f pwm2 pwm frequency2 29 ? khz 70 52 34 pwmsw = 0.6 v 2 f pwm1 pwm frequency1 28 ? a 125 100 83.3 v refa = 5 v v refb = 5 v 1 i refa i refb input bias current 27 ? s 1.12 0.75 0.38 v refa = v refb = 0 v 2 t b pulse blanking time 30 ? ? 27 18 ? i s5vout = ?1.5 ma, ?3.5 ma 1 z s5vout output impedance 35 ? v 5.5 5.0 4.5 i s5vout = 0 ma 1 v s5vout reference voltage 34 limits typ unit max test circuits note min conditions symbol parameter b no. ? electrical characteristics (continued) at v m =24 v note) t a = 25 c 2 c unless otherwise specified.
11 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601108040 2008-04-11 ? k ? 60 50 40 v refa = 5 v v refb = 5 v ? z vrefa z vrefb input impedance 41 i/o block *1 a ? 68 ? pha1 = phb1 = 5 v ? i phah2 i phbh2 high-level pha1/phb1 input current 2 43 vref block ? % 20 ? ?20 ? ? ? input impedance precision 42 ? oc ? 40 ? ? ? ? tsd thermal protection hysteresis width 40 pwmsw = 5 v output voltage falling edge ? s ? 2.8 ? ? ? t d dead time 38 thermal protection ? oc ? 150 ? ? ? tsd on thermal protection operating temperature 39 *1 a ? 42 ? ? i pwmswh2 high-level pwmsw input current 2 44 output drivers ? v/ s ? 270 ? output voltage rising edge ? vt r output slew rate 1 36 ? v/ s ? 330 ? ? vt f output slew rate 2 37 reference values typ unit max test circuits note min conditions symbol parameter b no. note) *1 : refer to the ?usage notes? (p.35) for the input current characteristics about pha1, phb1, pwmsw. ? electrical characteristics (reference values for design) at v m = 24 v notes) t a = 25 c 2 c unless otherwise specified. the characteristics listed below are reference values derived fr om the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteris tics, we will respond in good faith to user concerns.
12 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601208040 2008-04-11 17 bc2 18 bc1 32 tjmon 20 vrefb 26 phb1 21 s5vout 22 stby 27 in0 28 in1 rcsb 5 bout2 3 bout1 7 n.c. 12 n.c. 2 vm1 1 n.c. 4 n.c. 8 rcsa 11 aout2 9 aout1 13 n.c. 14 vm2 15 vpump 16 23 gnd 29 in2 30 in3 31 enablea 25 pha1 24 pwmsw 19 vrefa n.c. 10 n.c. 6 a v sin3 i in3 i in2 i in1 i in0 i pha1 i phb1 v sin2 v sin1 v sin0 v sphb1 v spha1 v sena i ena 0.01 f s6 i pwmsw v pwmsw 0.1 f v s5vout i s5vout v v srefb i refb v srefa i refa a v stby i stby v i vm v m a 0.01 f 2 1 s5 v sa1 v aout1 v srcsa v rcs a v sa2 v aout2 s4 1 2 s3 2 1 3 3 v v v v sb1 v bout1 v srcsb v rcsb v sb2 v bout2 s2 1 2 s1 2 1 3 3 v v v 10 k ? 10 k ? a a a a a a a a a 12 v 75 ? 12 v 75 ? 12 v 75 ? 12 v 75 ? ? test circuit diagram 1. test circuit 1
13 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601308040 2008-04-11 v m 24 v 0.01 f v phb1 v pha1 0.01 f 15 ? 330 h 0.68 ? v rcsa v 0.68 ? v rcsb v 330 h 15 ? 47 f v pwmsw 1 f 0.6 v bc2 bc1 tjmon vrefb phb1 s5vout stby in0 in1 rcsb bout2 bout1 n.c. n.c. vm1 n.c. n.c. rcsa aout2 aout1 n.c. vm2 vpump gnd in2 in3 enablea pha1 pwmsw vrefa n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 32 20 26 21 22 27 28 23 29 30 31 25 24 19 ? test circuit diagram (continued) 2. test circuit 2
14 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601408040 2008-04-11 v bout2 v bout1 v aout2 v aout1 2 1 s9 3 4 i in v m 24 v 1 f 0 v 0.01 f v phb1 v pha1 0.01 f 47 f v v v v 3.3 v 2.5 v 2.5 v bc2 bc1 tjmon vrefb phb1 s5vout stby in0 in1 rcsb bout2 bout1 n.c. n.c. vm1 n.c. n.c. rcsa aout2 aout1 n.c. vm2 vpump gnd in2 in3 enablea pha1 pwmsw vrefa n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 32 20 26 21 22 27 28 23 29 30 31 25 24 19 ? test circuit diagram (continued) 3. test circuit 3
15 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601508040 2008-04-11 v bout2 v bout1 2 1 s9 3 4 i in 17 bc2 18 bc1 32 tjmon 20 vrefb 26 phb1 27 in0 28 in1 rcsb 5 bout2 3 bout1 7 n.c. 12 v aout2 v aout1 n.c. 2 vm1 1 n.c. 4 n.c. 8 rcsa 11 aout2 9 aout1 13 n.c. 14 vm2 15 vpump 16 23 gnd 29 in2 30 in3 31 enablea 25 pha1 24 pwmsw 19 vrefa n.c. 10 n.c. 6 v v v v 21 s5vout 22 stby 1 f ? test circuit diagram (continued) 4. test circuit 4
16 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601608040 2008-04-11 5 v ?1.5 ?3.5 ma 0.6 v 24 v hi-z hi-z 0 v 3.3 v 0 v 0 v 0 v 3.3 v on 2 1 1 21 35 5 v hi-z 0 v 24 v hi-z hi-z 0 v 3.3 v 0 v 0 v 0 v 0 v off 1 1 1 19, 20 27 5 v hi-z 0.6 v 24 v hi-z hi-z 0 v 3.3 v 2.2 v *1 *1 0.6 v on 2 3 3 3, 7, 9, 13 16 5 v hi-z 0.6 v 24 v hi-z hi-z 0 v 3.3 v 0.6 v 0.6 v 2.2 v 0.6 v on 2 3 3 3, 7, 9, 13 12 5 v hi-z 0 v 24 v hi-z hi-z 0 v 3.3 v 5 v 5 v 5 v 3.3 v on 2 1 1 24, 25, 26 13 21 5 v hi-z 0 v 24 v hi-z hi-z 0 v 5 v 5 v 5 v 5 v 5 v on 2 1 1 27, 28, 29 30, 31 9 17 5 v hi-z 0.6 v 24 v hi-z hi-z 0 v 3.3 v 0 v 0v 0 v 3.3 v on 2 1 1 21 34 3.3 v 3.3 v 3.3 v 5 v 5 v 5 v 5 v 5 v 5 v 2.5 v 2.5 v 2.5 v v srefa v srefb hi-z 5 v 24 v hi-z hi-z 0 v 3.3 v 5 v 5 v 5 v 3.3 v on 2 1 1 22 25 hi-z 2.1 v 24 v hi-z hi-z 0 v 5 v 5 v 5 v 5 v 5 v on 2 1 1 1, 15, 22 6 23 3, 9 7, 13 3.3 v 3.3 v 3.3 v 3.3 v 3.3 v 3.3 v 0 v 3.3 v 3.3 v 3.3 v v pwmsw hi-z 0 v 24 v hi-z hi-z 0 v 1 v 0 v 0.6 v 2.2 v 3.3 v off 1 2 2 3, 9 7 8 32 hi-z 0 v 24 v hi-z hi-z 0 v 1 v 0 v 0.6 v 0.6 v 3.3 v off 1 2 2 3, 9 8 31 hi-z 0.6 v 24 v hi-z hi-z 0 v 0.6 v *1 *1 0.6 v on 2 3 3 3, 7, 9, 13 15 hi-z 0.6 v 24 v hi-z hi-z 0 v 0.6 v 2.2 v 0.6 v 2.2 v on 2 3 3 3, 7, 9, 13 11 i s5vout v stby v m v sa1 v sb1 v sa2 v sb2 v srcsa v srcsb v sena v sin1 v sin3 v sin0 v sin2 v spha1 v sphb1 s6 s5 s2 s4 s1 s3 relay conditions 2 1 1 1 1 1 2 1 1 1 1 1 1 2 2 1 1 1 hi-z hi-z hi-z hi-z hi-z hi-z measuring pin no. voltage conditions 24 v 24 v 24 v 37 v 37 v 37 v 0 v 0.6 v 0 v 0 v 0 v 0 v 0 v 0 v 0 v 5 v 0 v 0 v 0 v off 3, 7, 9, 13 4 37 v hi-z 0 v 0 v 0 v 0 v 5 v off hi-z 37 v 0 v 0 v 0 v 0 v 0 v off hi-z hi-z 0 v 0 v 0 v 0 v 0 v on 22, 24, 25, 26, 27, 28, 29, 30, 31 10 14 18 22 26 hi-z hi-z 0 v 3.3 v 0 v 0 v 3.3 v on 1, 15, 22 5 24 hi-z hi-z 0 v 1 v 0 v 2.2 v 0.6 v 3.3 v off 3, 9 7 8 33 note) *1 : refer to the ?electrical characteristics test procedures? (p.18) for the input voltage of v sin0 , v sin1 , v sin2 , v sin3 (no.15, no16). ? electrical characteristics test procedures 1. test circuit 1
17 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601708040 2008-04-11 7) high-level in input voltage v inh 8) low-level in input voltage v inl 31) comp threshold h (100%) vt h 32) comp threshold c (67%) vt c 33) comp threshold l (33%) vt l v rcsa / v rcsb 12 v 24 v 0 v region a region b 0.6 v 2.2 v 0.6v v sin2 voltage conditions no. measure the v aout2 /v bout2 threshold voltage. 2.2 v 2.2 v 0.6 v aout2 / bout2 7, 8, 33 7, 8, 32 8, 31 measure the v aout2 /v bout2 threshold voltage. 0.6 v 0.6 v 2.2 v aout2 / bout2 v sin3 v sin1 v sin0 measure the v aout2 /v bout2 threshold voltage. 0.6 v 0.6 v 0.6 v aout2 / bout2 status measuring pin 11) high-level pha1/phb1 input voltage v phah , v phbh 12) low-level pha1/phb1 input voltage v phal , v phbl measure the aout1/bout1 voltage and aout2/bout2 voltage with the input voltage set to high level and low level respectively. aout2 /bout2 aout2 /bout2 low-level output 2.2 v high-level output 2.2 v aout1 /bout1 v spha1 / v sphb1 high-level output low-level output 0.6 v aout1 /bout1 0.6 v status voltage conditions measuring pin v spha1 / v sphb1 v aout1 , v bout1 24 v v aout2 , v bout2 v spha1 / v sphb1 spec spec 0.6 v 2.2 v 24 v spec spec 0 v 0 v "l" "l" "h" "h" v aout2 , v bout2 ? electrical characteristics test procedures (continued) 1. test circuit 1(continued) perform rcs voltage sweeping and measure the threshold voltages on the output pins respectively. region a : always high-level output region b : high-level output with the duty kept to a minimum
18 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601808040 2008-04-11 set to v spha1 /v sphb1 = 0.6 v and check that the threshold voltage is in the specification range (spec) under the following condition 0.6 v 0 v v sin0 0.6 v 0 v v sin1 2.2 v 0 v v sin2 0.6 v 0 v v sin3 12 v 0 v v aout1 / v bout1 2.2 v 12 v 24 v 0.6 v v aout2 / v bout2 v sena 35) output impedance z s5vout z s5vout = 2ma v a ?v b v s5vout i s5vout 0 ma ?3.5 ma v a v b ?1.5 ma v enable v aout1 , v bout1 12 v v aout2 , v bout2 v enable spec spec 0.6 v 2.2 v 24 v spec spec 0 v 0 v 15) high-level enablea input voltage v enableah 16) low-level enablea input voltage v enableal 12 v ? electrical characteristics test procedures (continued) 1. test circuit 1(continued)
19 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406601908040 2008-04-11 2. test circuit 2 19) high-level pwmsw input voltage v pwmswh 20) low-level pwmsw input voltage v pwmswl 28) pwm frequency1 f pwm1 29) pwm frequency2 f pwm2 30) pulse blanking time t b each value is obtained by the voltage of aout1, aout2, bout1, and bout2 at v refa = v refb = 0 v and pha1 = phb1 = 0 v or pha1 = phb1 = 3.3 v. the v aout1 / v aout2 / v bout1 / v bout2 output waveform is shown below. pwm frequency f pwm measure the cycle time of out put voltage pulses and obtain the value from the following formula. f pwm = 1 / t pwm v aout1 / v aout2 / v bout1 / v bout2 output waveform t b 0 v 12 v t b t pwm t[ s] pulse blanking time t b measure the low-level time of voltage output. pwmsw input voltage pwmsw v pwmswh / v pwmswl 52 khz 26 khz 2.2 v pwmsw 0.6 v status voltage conditions measuring pin ? electrical characteristics test procedures (continued)
20 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602008040 2008-04-11 3. test circuit 3 1) high-level output saturation voltage v oh 2) low-level output saturation voltage v ol 2 1 c no. measure the aout1, aout2, bout1, and bout2 voltage at (e) to (h) above. 0.5 a aout1/aout2/bout1/bout2 = s4 / s3 / s2 / s1 aout1/aout2 bout1/bout2 i in s9 measure the aout1, aout2, bout1, and bout2 voltage at (a) to (d) above. ?0.5 a aout1/aout2/bout1/bout2 = s4 / s3 / s2 / s1 aout1/aout2 bout1/bout2 status conditions measuring pin v pha1 v phb1 v aout1 24 v 12 v 0 v 5 v 0 v 5 v 0 v 24 v 12 v 0 v v bout1 v aout2 24 v 12 v 0 v 24 v 12 v 0 v v bout2 (a) (b) (c) (f) (e) (g) (d) (h) 4. test circuit 4 3) flywheel diode voltage v di apply 0.5 a to i in , and measure the v aout2 . 3 aout2 3 apply 0.5 a to i in , and measure the v bout1 . 2 bout1 3 1 4 s9 apply 0.5 a to i in , and measure the v aout1 . aout1 3 3 c no. i in apply 0.5 a to i in , and measure the v bout2 . bout2 measuring pin ? electrical characteristics test procedures (continued)
21 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602108040 2008-04-11 pin16 : charge pump circuit output 17 : charge pump capacitor connection 2 ? ? 16 17 pin3 : phase b motor drive output 2 5 : phase b current detection 7 : phase b motor drive output 1 9 : phase a motor drive output 2 11 : phase a current detection 13 : phase a motor drive output 1 ? ? 3 5 7 9 11 13 impedance description internal circuit waveform and voltage pin no. 16 pin3 bout2 7 bout1 9 aout2 13 aout1 pin5 rcsb 11 rcsa 16 17 bc2 vpump 3k 3k 100k 100k 4k 150k 125 ? technical data y circuit diagrams of the input/output part and pin function descriptions note) the characteristics listed below are reference values based on the ic design and are not guaranteed.
22 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602208040 2008-04-11 pin19 : phase a torque reference voltage input 20 : phase b torque reference voltage input 50 k ? ? 19 20 pin18 : charge pump capacitor connection 1 ? ? 18 impedance description internal circuit waveform and voltage pin no. 18 bc1 pin19 vrefa 20 vrefb 150 200 4k 40k 10k 15.91k 3.98k ? technical data (continued) y circuit diagrams of the i nput/output part and pin function descriptions (continued) note) the characteristics listed below are reference values based on the ic design and are not guaranteed.
23 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602308040 2008-04-11 pin22 : standby setting 154.5 k ? ? 22 pin21 : internal reference voltage (5 v output) ? ? 21 impedance description internal circuit waveform and voltage pin no. 21 pin21 s5vout pin22 stby 103k 51.5k 22 102k 2k ? technical data (continued) y circuit diagrams of the i nput/output part and pin function descriptions (continued) note) the characteristics listed below are reference values based on the ic design and are not guaranteed.
24 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602408040 2008-04-11 pin25 : phase a phase selection input 26 : phase b phase selection input 100 k ? ? 25 26 pin24 : pwm frequency selection input 200 k ? ? 24 impedance description internal circuit waveform and voltage pin no. pin24 pwmsw 4k 200k 50k 26 phb1 25 pha1 pin 4k 100k 50k ? technical data (continued) y circuit diagrams of the i nput/output part and pin function descriptions (continued) note) the characteristics listed below are reference values based on the ic design and are not guaranteed.
25 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602508040 2008-04-11 pin32 : vbe monitor ? ? 32 ? ? ? sym bols pin27 : phase a output torque control 1 28 : phase a output torque control 2 29 : phase b output torque control 1 30 : phase b output torque control 2 31 : phase a/b start/stop signal input ? ? 27 28 29 30 31 impedance description internal circuit waveform and voltage pin no. 32 pin32 tjmon s5vout (pin21) vm(pin1, pin15) diode zener diode ground 800 28 in1 29 in2 30 in3 31 enablea pin27 in0 100k 4k ? technical data (continued) y circuit diagrams of the i nput/output part and pin function descriptions (continued) note) the characteristics listed below are reference values based on the ic design and are not guaranteed.
26 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602608040 2008-04-11 off off ? high high low low low low aout2/bout2 low enablea high high aout1/bout1 pha1/phb1 notes) rs : current detection region in1 = in3 = low level 2) output polarity off on high low low ? enable low high stby on on off off output transistor control/charge pump circuit 1) control/charge pump circuit (vref / 5) (1 / rs) (1 / 3) high low low high high low low in2 (vref / 5) (1 / rs) (2 / 3) (vref / 5) (1 / rs) 0 (vref / 5) (1 / rs) a-ch. output current low low low high don't care high low in0 low in1 a-ch. output b-ch. output high high low low in2 (vref / 5) (1 / rs) (2 / 3) (vref / 5) (1 / rs) 0 (vref / 5) (1 / rs) a-ch. output current 0 low (vref / 5) (1 / rs) (2 / 3) high (vref / 5) (1 / rs) high low in0 (vref / 5) (1 / rs) b-ch. output current 3) output current of 2-phase excita tion / half step / 1-2 phase excitation 4) output current of w1-2 phase excitation (vref / 5) (1 / rs) (1 / 3) high low low high high low low in2 0 don't care low (vref / 5) (1 / rs) (2 / 3) low high (vref / 5) (1 / rs) low high low in0 (vref / 5) (1 / rs) low b-ch. output current in3 ? technical data y control mode 1. truth table note) rs : current detection region note) rs : current detection region
27 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602708040 2008-04-11 1) drive of 2-phase excitation (4steps sequence) (in0 to in3 = low) a-ch. motor current v phb1 1234 fwd flow-in flow-out flow-in flow-out v pha1 b-ch. motor current 1234 rev flow-in flow-out flow-in flow-out a-ch. motor current b-ch. motor current v phb1 v pha1 ? technical data (continued) y control mode (continued) 2. output wave
28 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602808040 2008-04-11 2) drive of half step (8-steps sequence) (in1 = in3 = low) (ex.) fwd 1234 78 56 a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in2 1234 78 56 rev a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in2 rev fwd ? technical data (continued) y control mode (continued) 2. output wave (continued)
29 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406602908040 2008-04-11 (ex.) fwd 123456 78 a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in2 rev 1 2 345678 a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in2 3) drive of 1-2 phase excitation (8-steps sequence) (in1 = in3 = low) rev fwd ? technical data (continued) y control mode (continued) 2. output wave (continued)
30 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603008040 2008-04-11 4) drive of w1-2 phase excitation (16-steps sequence) 12345678910111213141516 fwd a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in1 v in2 v in3 12345678910111213141516 rev a-ch. motor current flow-in flow-out flow-in flow-out b-ch. motor current v phb1 v pha1 v in0 v in1 v in2 v in3 rev fwd ? technical data (continued) y control mode (continued) 2. output wave (continued)
31 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603108040 2008-04-11 y special attention and precaution in using 1. this ic is intended to be used for general electronic equipment and driving stepping motor. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v m short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. pay special attention to the following pins so that they are not short-circuited with the vm pin, ground pin, other output pin, or current detection pin. (1) aout1 (pin 13), aout2 (pin 9), bout1 (pin 7), bout2 (pin 3) (2) bc2 (pin 17), vpump (pin 16) (3) vm1 (pin 1), vm2 (pin 15), s5vout(pin 21) (4) rcsa (pin 11), rcsb (pin 5) the higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke generation. therefore, it is recommended to take safety countermeasures, such as the use of a fuse. 6. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 7. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. ? usage notes
32 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603208040 2008-04-11 y notes of power lsi 1. perform thermal design work with consider ation of a sufficient margin to keep the power dissipa tion based on supply voltage, load, and ambient temperature conditions. (the ic is recommended that junctions are designed below 70% to 80% of absolute maximum rating.) 2. the protection circuit is incorporated for the pur pose of securing safety if the ic malfunctions. therefore, design the protection circuit so that the protectio n circuit will not operate under normal operating conditions. the temperature protection circuit, in particul ar, may be destructed before the temperature protection circuit operates if the area of safety operation of the device or the maximum rating is exceeded instantaneously due to the short-circuiting between the output pin and vm pin or a ground fault caused by the output pin and ground pin. 3. unless specified in the product specifications, make sure that negative voltage or excessive vo ltage are not applied to the p ins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the on and off timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 4. the product which has specified aso (area of safe operation) shoul d be operated in aso. 5. verify the risks which might be caused by the malfunctions of external components. 6. set the value of the cap acitor between the vpump and gnd pins so that the voltage on the vpump (pin 16) will not exceed 43 v in any case regardless of whether it is a transient phe nomenon or not while the motor standing by is started. 7. this ic employs a pwm drive method that switches the high-current output of the output transistor. therefore, the ic is apt t o generate noise that may cause the ic to malfunction or have fatal damage. to preven t these problems, the power supply must be stable enough. therefore, the capacitance be tween the s5vout and gnd pins must be 0.1 f and the one for power supply stabilization between th e vm and gnd pins must be a minimum of 47 f (recommendation) and as close as possible to the ic so that pwm noise will not cause the ic to malfunction or have fatal damage. ? usage notes (continued)
33 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603308040 2008-04-11 t b 1/f pwm normal operation the set current is less than the minimum current. set current set current minimum current f pwm : pwm frequency t b : pulse blanking time (refer to no. 28 to no. 30 of electrical characteristics) fig. 1 rcs current waveform 8. pulse blanking time in order to prevent mistakes in current detection resulting no ise, this ic is provided w ith a pulse blanking time of 0.75 s (typ.). the motor current will not be less than the current determined by the pulse blanking time. pay utmost attention at the time of minute current control. fig.1 shows the relationship between the pul se blanking time and min imum current value. the increase or decrease in the motor current is determined by a load and a resistance of a internal winding in the motor, induc ed voltage, and pwm on-duty. 9. vref voltage when vref voltage is set to lower, an error detection of motor current might be caused by noise because comp threshold voltage (no.31, 32, 33 in the ?electrical character istics? / p.10) becomes low. use this ic after confirming there is no error detection when vref voltage is less than the set value. 10. notes on the interface absolute maximum ratings of pin 19, 20, 22 and pin 24 to pin31 are ?0.3 v to 6 v. when the current setting for a motor is large and the lead line of gnd is long, the potentia l of gnd in this lsi will rise. take notic e that there is a possibility that pote ntial of the interface pin is negative comp ared with that of gnd in this lsi even if 0 v is applied to the interf ace pin. at that time, pay attention so that the input voltage of these pins might not ex ceed the values which are set in the allowable voltage range. ? usage notes (continued)
34 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603408040 2008-04-11 11. notes at the clear of standb y mode / the rise of vm supply in this lsi, all phases are forced off for about 300 s (typ.) after the clear of standby mode or the rise of vm supply. (see the following figure.) this is why the operation mode can be started af ter the charge pump circuit vol tage boosts efficiently at shi ft to operation mode from standby mode / vm suppl y = off, when the charge pump operation stops. therefore, the excitation patterns input after the forced all phase off period are effect. when the charge pump circuit rises slowly owing to that the cap acitance value between vpump-gnd is made large etc. and the booster voltage cannot rise efficiently for th e forced all phase off, the ic might over heat. in this case, clear the standby mode at enable = high or restart after vm supply is turned on, the booster voltage rises efficiently, and enable is shifted to low. the thermal protection is same oper ation as that at vm supply off. motor output standby standby forced all phase off start-up (at enable = low) all phase off (at enable = high) stby about 300 s(typ) high low all phase off motor output forced all phase off start-up (at enable = low) all phase off (at enable = high) vm about 300 s(typ) low high all phase off (low voltage protection) [in case that standby mode is cleared] [in case that vm supply rises] after vm supply exceeds threshold vm = 8.8 v( typ), all phases are forced off for about 300 s(typ). standby mode clear ? usage notes (continued)
35 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603508040 2008-04-11 18.48?y<7> 18.48?v<v"> z = 200 k ? 18.487 s5vout = 5.0 v s5vout = 4.5 v fig. 2 input impedance of pha1/phb1 at vm power supply power on fig. 3 input impedance of pwmsw at vm power supply power on s5vout = 5.5 v z = ? 4.7 k ? ? usage notes (continued) z ? 4.7 k ? pwmsw voltage [v] pwmsw current [ a] 12. pwmsw, pha1, phb1 pins under conditions where vm power supply is shutdown in standby mode (stby pin = high level), when applying approx. 0.7 v (typ) or more to pwmsw (pin 24), pha1 (pin 25), phb1 (pin 26), the current flows into above-mentioned pins owing to parasitic elements in the lsi and the current flowing into the above-mentioned pins varies from the current determined by pull down resistance. in addition, the cu rrent flowing into pha1/pha2 is 341.4 a (impedance = approx. 9.1 k ? ) at 3.3 v, while that into pwmsw is 323.2 a (impedance = approx. 9.7 k ? ) at 3.3 v. there is no problem that the voltage up to rating is applied to the above-mentioned pins. however, it is recommended to set the voltage applied to the above-mentioned to 0.7 v or less at shutdown of vm power s upply in standby mode. also, in case of the voltage of above-mentioned pins > s5vout(pin 21) ? 0.2 v at power on to vm power supply, the current flows owing to parasitic elements in the lsi, and the current fl owing into the above-mentioned pins varies (refer to fig. 2, 3 ). as the same as at standby, there is no problem that the voltage up to rating is applied to the above-mentioned pi ns. however, i t is recommended to set the voltage applied to the above-mentioned pins to 4.3 v or less. @@@@@ 1)"1)#?v<v"> 1)"1)#7 s5vout = 5.0 v s5vout = 4.5 v s5vout = 5.5 v z = ? 4.7 k ? z = 200 k ? pha1/phb1 voltage [v] pha1/phb1 current [ a] z ? 4.7 k ?
36 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603608040 2008-04-11 temp[ c] vbe[v] ? vbe / ? temp = ?1.82 [mv / c] 150 0 the temperature charac teristic of tjmon 13. in the case of measuring the chip temperature of the ic, meas ure the voltage of tjmon (pin 32) and presume chip temperature from following data. use the following data as reference data. before applying the ic to a product, conduc t a sufficient reliab ility test of the ic along with the evaluation of the product with the ic incorporated. power supply vm time rising edge every 0.1 v/ sor less falling edge every 0.1 v/ sor less ? usage notes (continued) 14. power supply start up speed and shutdown speed set the rising speed to 0.1 v/ s or less for vm voltage at power on to vm (pin 1, 15). it is recommended that the falling speed of vm voltage is set to 0.1 v/ s or less on condition of stby = high or enable = high at shutdown. in case of shutdow n at motor drive (stby = low and enable = low) , the motor current might flow back to the power supply and suppl y voltage might not fall stably. if the rising or falling speed of power supply is too high, which mi ght cause malfunctions or destruction on the ic. in this ca se, perform the long-term reliability test and c onfirm the sufficient evaluation for products.
37 37 an44066a product standards established revised total pages page semiconductor company, matsushita electric industrial co., ltd. 214406603708040 2008-04-11 16. a high current flows into this ic. therefore, the common impeda nce of the pcb pattern cannot be ignored. take the following points into consideration and design the pcb pattern of the motor. a high current flows into the line between the vm1 (pin 1) and vm 2 (pin 15) pins. therefore, noise is generated with ease at th e time of switching due to the inductance (l) of the line, which ma y result in the malfunctioning or destruction of the ic. (fig. 4) as shown in the circuit diagram on the right -hand side, the escape way of the noise is secured by connecting a capacitor to the connector close to the vm pin of the ic. this makes it possible to suppress the direct vm pin voltage of the ic. make the setti ngs as shown in the circuit diagram on fig. 5 as much as possible. fig. 4 deprecated pcb vm gnd l c rcs vm gnd fig. 5 recommended pcb vm gnd l c rcs vm gnd low spike amplitude due to the capacitance between the vm pin and ground pin 15. rcs line take consideration in the following figur e and the points and design pcb pattern. (1) point 1 design so that the wiring to the current detection pins of th is ic (rcsa, rcsb) should be thic k and short in order to lower the impedance. this is why the current cannot be detected correctly owing to th e wiring impedance, and the current might not be supplied to a motor sufficiently. (2) point 2 design so that the wiring between the current detection resi stor and the connector gnd (point 2 in the following figure) should be thick and short in order to lowe r the impedance. as the same as point 1, a sufficient current might not be supplied due to the wiring impedance. in addition, if there is a common im pedance between gnd and rcsa or rcsb, a peak detection may be detected by mistake. therefore, connect the wiring between gnd and rcsa or rcsb independently. (3) point 3 connect the gnd of this ic to the connector on pcb independ ently. separate the wiring wh ich is a large current line (point 2) from that of gnd, and make thes e wirings with one-point shorted at the connector as the following figure. that can minimize the fluctuation of gnd. motor connector gnd gnd rcsa/rcsb ic current limit detection resister point 1 point 2 point 3 (a) ic ic ? usage notes (continued)
package standards regulations no. : sc3s1711 package code semiconductor company matsushita electric industrial co., ltd. ssop032-p-0300b total pages page 1 6 m.itoh m.okajima h.yoshida k.komichi prepared by checked by applied by established by exclusive use for an44066a established: 2008-01-08 revised : -
semiconductor company, matsushita electric industrial co., ltd. unit:mm 1. outline drawing lead finish method : snbi plating lead material : cu alloy body material : epoxy resin total pages page 62 package standards ssop032-p-0300b exclusive use for an44066a established: 2008-01-08 revised : -
semiconductor company, matsushita electric industrial co., ltd. total pages page 63 package standards ssop032-p-0300b 2. package structure (technica l report : reference value) exclusive use for an44066a 1 2 3 4 method material method material method material 316 42 5 7 si transfer molding epoxy resin wirebond outer lead surface au cu alloy ag plating leadframe material inner lead surface chip material 5 6 7 resin adhesive method mass 250 mg snbi plating adhesive material thermo-compression bonding molding chip mount established: 2008-01-08 revised : -
semiconductor company, matsushita electric industrial co., ltd. total pages page 64 package standards ssop032-p-0300b 3. mark drawing exclusive use for an44066a product name brand mark date code established: 2008-01-08 revised : -
semiconductor company, matsushita electric industrial co., ltd. total pages page 65 package standards ssop032-p-0300b 4. power dissipation (technical report) exclusive use for an44066a 0.000 0.200 0.400 0.600 0.800 1.000 1.200 1.400 0 25 50 75 100 125 150 ambient temperature( o c ) power dissipation() mount on pwb glassepoxy:50x50x0.8t(mm) rth(j-a) = 96.9 oc/w without pwb rth(j-a) = 187.1 oc/w 1.290 0.668 established: 2008-01-08 revised : -
semiconductor company, matsushita electric industrial co., ltd. total pages page 66 package standards ssop032-p-0300b 5. power dissipation supplementary explanation package semiconductor element rth(j-c) rth(c-a) rth(j-a) ta tc tj pwb [ definition of each temperature and thermal resistance ] ta ambient air temperature t the temperature of the air is defined at the position where the convection, radiation, etc. don?t affect the temperature value, and it?s separated from the heating elements. tc it?s the temperature near the center of a packa ge surface. the package surface is defined at the opposite side if the pwb. tj semiconductor element surface tem perature (junction temperature.) rth(j-c) the thermal resistance ( difference of temperature of per 1 watts) between a semiconductor element junction part and the package surface rth(c-a) the thermal resistance (difference of temperature of per 1 watts) between the package surface and the ambient air rth(j-a) the thermal resistance (difference of temperature of per 1 watts) between a semiconductor element junction part and the ambient air [ supplementary information of pwb to be used for measurement ] the supplement of pwb information for power dissipation data (technical report are shown below. fr-4 4-layer 4-layer fr-4 1-layer glass-epoxy resin material total layer indication [notes about power dissipation thermal resistance ] power dissipation values thermal resistance depend on the conditions of the surroundings, such as specification of pwb and a mounting condition , and a ambient temperat ure. (power dissipation (thermal resistance) is not a fixed value.) the power dissipation value technical report is the experiment result in specific conditions (evaluation environment of semi standard conformity) ,and keep in mind that power dissipation values (thermal resistance) depend on circumference conditions and also change. [ experiment environment ] power dissipation technical report is a result in the experiment environment of semi standard conformity. ambient air temperature ( ta) is 25 degrees c [definition formula] rth(j-c) = tj-tc p rth(c-a) = tc-ta p rth(j-a) = tj-ta p ( ? /w) ( ? /w) ( ? /w) tj={rth(j-c)+rth(c-a)} p+ta =rth(j-a) p+ta p:power(w) fig1. definition image = rth(j-c) rth(c-a) exclusive use for an44066a established: 2008-01-08 revised : -
in case that the semiconductor packages are mounted on the pcb, the soldering should be performed under the following conditions. reflow soldering peak temperature : less than 260 temperature is measured at package surface point wave soldering (flow soldering) temp. of solder : 260 or less soak time : within 5 s number of flow : only 1 time manual soldering iron temperature : 350 or less (device lead temperature : 270 ? 10 s max.) soldering time : within 3 s number of manual soldering : only 1 time no. value recommended soldering conditions max. 260 reflow peak temp. : industrial devices company, panasonic corporation 2012/3/7 prepared revised no mark contents recommended soldering conditions total pages page 21 1t1 pre-heating temp. 150 180 2 pre-heating temp. hold time 60 s 120 s 3a rising rate 2 /s 5 /s 4tp peak temp. 255 +5 ? -0 5tp peak temp. hold time 10 s3 s b down rate 2 /s 5 /s 6tw high temp. region hold time within 60 s ( R 220 ) 11-183 product name : package : AN44066A-VF ssop032-p-0300b 8- number of reflow within 2 times 7 140 160 180 200 220 240 255 time t1 t1 tw tp tp 220 260 a b 260
because the taping and the magazine materials are not the heat-resistant materials, the bake at 125 cannot be done. therefore, please solder everything or control everything in the rule time. please keep them in an equal environment with the moisture-proof packaging or dry box. (temperature: room temperature, relative humidity: 30% or less. ) to control storage time, when bake in the taping and the magazine is necessary, it is necessary for each type to set a bake condition. please inquire of our company. storage environment conditions: keep the following conditions ta=5 30 ? rh=30 % 70 %. storage period before opening dry pack shall be 1year from a shipping day under ta=5 30 ? rh=30 % 70 %. when the storage exceeds, bake at 125 with 15 h to 25 h. baking cycle should be only one time. please be cautious of solderability at baking. in case that use reflow two times, 2nd reflow must be finished within 336 hours . remove flux sufficiently from product in the washing process. ( flux : chlorineless rosin flux is recommended.) in case that use ultrasonic for product washing, there is the possibility that the resonance may occur due to the frequency and shape of pcb. it may be affected to the strength of lead. please be cautious of this matter. no. industrial devices company, panasonic corporation 2012/3/7 prepared revised recommended soldering conditions total pages page 22 AN44066A-VF limitation, low temperature bake condition 40 / 25 %rh or less / 192 h 11-183 2 storage environment after dry pack opening open dry pack storage environment kept up to reflow soldering (at 30 /70 %rh max. , within 336 h ) storage environment kept up to wabe soldering (at 30 /70 %rh max. , within 336 h ) soldering bake at 125 with 15 h to 25 h *please refer to the following when doing at the low temperature bake. when the storage time exceeds ( 336 h or 336 h ) 3 note
semiconductor company, panasonic corporation 2009.03.09 prepared revised recommended land pattern total pages page 11
specifications of packing by the embossment tape ( specifications for dampproof packing of the reel without the inner carton) total pages 3 packing specification page 1 revised semiconductor company panasonic corporation prepared 2009.03.09 an12345a-nb 3000pcs. (3n)an12345a-nb 1000 (3n)2 10n112200-nb 108010 an12345a-nb an12345a-nb 1.23-45 410n112300 2058 usp4b42516 an12345a-nb 12345678 3000 23456789 3000 34567890 3000 45678901 3000 307 150000 panasonic m made in japan embossment carrier tape top cover tape an12345a-nb 90000pcs. (3n)an12345a-nb 1000 (3n)2 10n112200-nb 108010 an12345a-nb an12345a-nb 1.23-45 410n112300 2058 usp4b42516 an12345a-nb 12345678 3000 23456789 3000 34567890 3000 45678901 3000 307 150000 panasonic m made in japan corrugated cardboard for partition outer box laminated aluminum bag inner frame c3 label (sampl) reel desiccant c3 label (sampl)
revised semiconductor company panasonic corporation prepared 2009.03.09 total pages 3 packing specification page 2 package : ssop032-p-0300b unit : mm packing 1) tape reel vf form ic quantity contents packing quantity 2) reel 3) packing cas e 2000 pcs reel 1pcs packing case 10000 pcs reel pcs 1 2 draw out direction emboss carrier ta p e 25.5 330 360 360 220
packing specification total pages page 33 2009.03.09 prepared revised semiconductor company panasonic corporation package : ssop032-p-0300b unit : mm
industrial devices company, panasonic corporation 1 kotari-yakemachi, nagaokakyo city, kyoto 617-8520, japan tel:075-951-8151
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